常见封装形式简介。
dip = dual inline package = 双列直插封装。
hdip = dual inline package with heat sink = 带散热片的双列直插封装。
sdip = shrink dual inline package = 紧缩型双列直插封装。
sip = single inline package = 单列直插封装。
hsip = single inline package with heat sink = 带散热片的单列直插封装。
sop = small outline package = 小外形封装。
hsop = small outline package with heat sink = 带散热片的小外形封装。
esop = small outline package with exposed thermal pad = 载体外露于塑封体的小外形封装
ssop = shrink small outline package = 紧缩型小外形封装。
tssop = thin shrink small outline package = 薄体紧缩型小外形封装。
tqpf = thin profile quad flat package = 薄型四边引脚扁平封装。
pqfp = plastic quad flat package = 方形扁平封装。
lqpf = low profile quad package = 薄型方形扁平封装。
elqpf = low profile quad flat package with exposed thermal pad = 载体外露于塑封体的薄型方形扁平封装。
dfn = dual flat non-leaded package = 双面无引脚扁平封装。
qfn = quad flat non-leaded package = 双面无引脚扁平封装。
to = transistor package = 晶体管封装。
sot = small outline of transistor = 小外形晶体管。
bga = ball grid array = 球栅阵列封装。
bqfp = quad flat package with bumper = 带缓冲垫的四边引脚扁平封装。
cad = computer aided design = 计算机辅助设计。
cbga = ceramic ball grid array = 陶瓷焊球阵列
ccga = ceramic column grid array = 陶瓷焊柱阵列。
csp = chip size package = 芯片尺寸封装
dfp = dual flat package = 双侧引脚扁平封装
dso = dual small outline = 双侧引脚小外形封装
3d = three-dimensional = 三维
2d = two-dimensional = 二维。
fcb = flip chip bonding = 倒装焊。
ic = integrated circuit = 集成电路。
i/o = input/output输入/输出。
lsi = large scale integrated circuit = 大规模集成电路。
mbga = metal bga金属基板bga
mcm = multichip module = 多芯片组件。
mcp = multichip package = 多芯片封装。
mems = microelectro mechanical system = 微电子机械系统。
mfp = mini flat package = 微型扁平封装。
msi = medium scale integration = 中规模集成电路
olb = outer lead bonding = 外引脚焊接。
pbga = plastic bga塑封bga
pc = personal computer = 个人计算机
pga = pin grid array = 针栅阵列
sip = system in a package = 系统级封装。
soic = small outline integrated circuit = 小外形封装集成电路
soj = small outline j-lead package = 小外形j形引脚封装
sop = small outline package = 小外形封装
sop = system on a package = 系统级封装。
wb = wire bonding引线健合
wlp = wafer level package = 晶圆片级封装
常用文件、表单、报表中英文名称。
清除通知单purge notice
工程变更申请ecr(engineering change request)
持续改善计划cip(continuous improvement plan)
戴尔专案dell project
收据receipt
数据表data sheet
核对表check list
文件清单documentation checklist
设备清单equipment checklist
调查表，问卷questionnaire
报名表entry form
追踪记录表tracking log
**表daily report
周报表weekly report
月报表monthly report
年报表yearly report
年度报表annual report
财务报表financial report
品质报表quality report
生产报表production report
不良分析报表far(failure analysis report)
首件检查报告first article inspection report
初步报告（或预备报告preliminary report
一份更新报告an undated report
一份总结报告a final report
纠正与改善措施报告(异常报告单) car (corrective action report)
出货检验报告outgoing inspection report
符合性报告（材质一致性证明） coc(certificate of compliance)
稽核报告audit report
品质稽核报告quality audit report
制程稽核报告process audit report
5s 稽核报告5s audit report
客户稽核报告customer audit report
**商稽核报告supplier audit report
年度稽核报告annual audit report
内部稽核报告internal audit report
外部稽核报告external audit report
spc 报表(统计制程管制statistical process control
工序能力指数(cpkprocess capability index
规格)上限upper limit
规格）下限lower limit
规格上限upper specification limit(usl)
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